R&M and US Conec Announce Partnership to Produce and Deploy Connectors for Harsh Environments

April 25, 2024
Agreement enables US Conec to manufacture and supply HEC connectors that are fully interoperable with the R&M format.

Fiber optic manufacturers Reichle & De-Massari (R&M) AG and US Conec Ltd. announced the execution of a definitive license agreement that enables US Conec to produce and supply Harsh Environment Connectors fully interoperable with R&M’s HEC-QR connector format.

The HEC-QR connector from R&M and the HEC-DC connector from US Conec encompass a next-generation family of connectors for harsh environments, supporting single fiber (SC), duplex (LC) and multi-fiber (MT) variants. The novel, 19mm circular housing format enables simple insertion and extraction in dense cabling environments via actuation by the strain relief boot. The IP 68 rated connector embodiment is compliant with the requirements of GR-3120 for single fiber applications and GR-3152 for multi fiber applications. The robust connector solution is ideal for applications requiring rugged optical connectivity such as fiber to the home, industrial, broadcast and transportation.

R&M CTO Robert Merki said, “the HEC-QR connector family offers the perfect combination of easy handling and robust performance. Together with US Conec, we will be able to offer solutions for harsh environment applications around the globe and set a new standard for pre-connectorized outdoor connectivity.

Mike Hughes, VP Product Management at US Conec, also commented, saying “we are excited to build on our long-standing partnership with R&M by collaborating on the next generation of harsh environment connectivity with the introduction of HEC-DC solutions with DirectConect™ technology. R&M delivers proven, reliable Swiss precision craftsmanship for fiber optic connector technologies. The simple push on insertion and quick release extraction mechanism for the new platform enables state-of-the-art, high-density optical connector functionality for harsh environment applications.

About the Author

ISE Staff